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The uniformity of vacuum coating film Jan 09, 2017

Vacuum coating equipment film uniformity has kind of a concept, below we'll help you learn better.

1. uniformity of thickness, can also be understood as the roughness, scales of optical thin film, vacuum coating uniformity has been quite good, roughness can be easily controlled in the visible wavelength range of 1/10, that is for the optical properties of the film, vacuum coating without any obstacles. But if he means uniformity on the atomic scale, in other words to achieve 10A or 1 a smooth surface, which depending on the coating gives a detailed explanation below.

2. chemical component Shang of uniform sex: that in film in the, compounds of atomic group branch due to scale had small and is easy of produced not uniform characteristics, SiTiO3 film, if plating film process not science, so actual surface of component is not SiTiO3, and may is other of proportion, plating of film is not is wants to of film of chemical components, this is vacuum plating film of technology content where. Specific factors are given below.

3. uniformity of lattice ordered: this film is a single crystal, polycrystalline, amorphous, is a hot issue of vacuum coating technology, see below.

Major classification there are two main categories: vapor deposition coating and sputtering coating, including many species, including vacuum ion evaporation, magnetron sputtering, MBE molecular beam epitaxy, sol-gel method and so on.

First, vapor deposition:

Is generally heated target surfaces of components to atoms or ions form evaporates.

Thickness uniformity depends mainly on:

1, the degree of lattice matching substrate materials and target

2, substrate temperature

3. the evaporating power, speed

4. vacuum

5. coating thickness size.

Evaporation coating composition is not very easy to guarantee the uniformity, specific regulatory factors as above, but because of the principle of limited for non-single-component coating, evaporation film composition uniformity is not good.

1, lattice matching

2, substrate temperature

3, the evaporation rate